Samsung Electro-Mechanics is partnering with a Japanese supplies firm to commercialize glass core, a core materials for glass substrates. The technique goals to dominate the glass substrate market, which has emerged as a core part for next-generation semiconductor packaging expertise, by means of supplies and parts cooperation between Korea and Japan.
Samsung Electro-Mechanics introduced on Nov. 5 that it signed a enterprise settlement (MOU) with Japan’s Sumitomo Chemical Group on Nov. 4 to evaluation the institution of a three way partnership (JV) for glass core manufacturing. The settlement ceremony held in Japan was attended by Samsung Electro-Mechanics President Jang Deok-hyun, Sumitomo Chemical Chairman Keiichi Iwata and President Nobuaki Mito, and Dongwoo Superb-Chem President Lee Jong-chan, a subsidiary of Sumitomo Chemical.
Glass core is a core materials for next-generation semiconductor bundle substrates. It’s characterised by low thermal enlargement charges and wonderful flatness in comparison with present natural (plastic) substrates.
By way of the three way partnership institution, Samsung Electro-Mechanics, Sumitomo Chemical, and Dongwoo Superb-Chem plan to mix every firm’s technological capabilities and international networks to safe manufacturing and provide strains for bundle substrate glass cores and speed up market entry.
Samsung Electro-Mechanics would be the main investor holding a majority stake, whereas the Sumitomo Chemical Group will take part as a further investor. The businesses plan to barter detailed possession construction, enterprise schedule, and company identify with the purpose of signing the primary contract subsequent yr. The company headquarters will probably be positioned at Dongwoo Superb-Chem’s Pyeongtaek facility and will probably be utilized because the preliminary glass core manufacturing base. Samsung Electro-Mechanics is at the moment producing glass substrate prototypes by means of pilot strains at its Sejong facility and plans to start full-scale mass manufacturing after 2027 along with the three way partnership.
President Jang stated, “This settlement will function a possibility to determine a brand new development axis within the next-generation semiconductor bundle market by combining the cutting-edge capabilities of the three corporations.” Chairman Iwata stated, “We anticipate to create important synergy within the superior semiconductor back-end course of area by means of cooperation with Samsung Electro-Mechanics.”
