Hanmi Semiconductor will launch its devoted tools “Broad TC Bonder” focusing on the next-generation excessive bandwidth reminiscence (HBM) market by the tip of 2026. The business expects this tools to be totally utilized ranging from HBM5 (eighth technology). This represents a preemptive response to the technological shift towards extensive HBM, which expands chip space horizontally, as the prevailing technique of vertically stacking DRAM reaches its limitations.
Hanmi Semiconductor introduced on Nov. 4 that it plans to provide the Broad TC Bonder to main shoppers ranging from the tip of 2026 for next-generation HBM chip manufacturing. The TC bonder is core tools obligatory for manufacturing HBM for synthetic intelligence (AI) semiconductors, utilized in processes that apply exact warmth and strain to bond DRAM dies when stacking them vertically.
Not too long ago, the reminiscence business has been looking for new breakthroughs to satisfy the calls for for larger capability and quicker speeds in HBM. As HBM evolves into next-generation merchandise, higher reminiscence capability and quicker information processing speeds are required, however the high-stacking technique of stacking greater than 20 DRAM layers is changing into more and more technically difficult. The business is at the moment pursuing the event of extensive HBM, which horizontally expands the HBM die space itself as a substitute of vertical stacking.
When the HBM die space turns into wider, the variety of by silicon vias (TSVs) and enter/output (I/O) interfaces will be stably elevated. The variety of micro bumps connecting DRAM dies and interposers additionally will increase, enabling the securing of reminiscence capability and bandwidth whereas facilitating thermal administration in comparison with high-stacking strategies and bettering energy effectivity.
The brand new Broad TC Bonder can optionally add fluxless bonding performance. It is a next-generation bonding expertise that reduces oxide movies on chip surfaces with out flux. In comparison with present strategies, it eliminates the necessity for residue cleansing processes, simplifying the method whereas rising bonding energy and lowering HBM thickness. Hanmi Semiconductor utilized a ‘celadon inexperienced’ shade to the tools design, impressed by Korean Goryeo celadon.
The business expects that the introduction of the Broad TC Bonder will additional delay the timing of hybrid bonder introduction, which had been thought of for next-generation HBM high-stacking manufacturing. Kwak Dong-shin, chairman of Hanmi Semiconductor, said, “We plan to proactively provide Broad TC Bonder tools incorporating new expertise according to HBM technological adjustments,” including, “This may contribute to strengthening our shoppers’ next-generation HBM manufacturing competitiveness.”
Established in 1980, Hanmi Semiconductor is a world semiconductor tools firm with roughly 320 shoppers worldwide. It at the moment holds the world’s primary place within the TC bonder marketplace for HBM manufacturing. Since 2002, the corporate has targeted on strengthening mental property rights and has filed roughly 120 patents associated to HBM tools so far.
