Semiconductor tools firm SEMES Co. introduced on Jan. 16 that it has achieved the primary mass manufacturing in Korea of the TEPAS 100, a sorter tools for semiconductor panel degree package deal (PLP).
The tools cuts uncooked materials packages into particular person items and inspects manufactured semiconductor chips, then types them into trays utilizing high-speed, high-precision sorting know-how. Its benefit lies within the skill to dry massive areas at excessive pace by making use of the corporate’s self-developed specialised know-how, the “Twister Blower” technique, through the washing and drying course of after reducing.
Choi Byung-gap, SEMES TP Group chief, mentioned, “Not too long ago, as demand for high-density integration and large-scale semiconductor packaging has elevated throughout numerous software fields, PLP know-how using massive panels is receiving a highlight,” including, “SEMES plans to strengthen its place within the international semiconductor packaging market by finishing its tools lineup for legacy package deal and wafer degree package deal (WLP), adopted by PLP.”
